14th generation Intel Meteor Lake processors are made of different tiles engraved on both Intel and TSMC. Intel plans to use three levels of workmanship for this generation.
For its 14th generation processors planned for 2023, Intel will use Foveros technology. Already used in Lockfield low power processors and soon on Ponte Vecchio server chips, this technology makes it possible to create a processor by combining different hardware “tiles”. One of the specialties of Meteor Lake is the use of three types of engraving techniques.
The first tile will be the graphic type. The integrated GPU is based on the Xe-LP Gen12.7 framework and embeds 192 implementation units. Good improvement compared to the current 96 maximum units of 12th generation processors. Intel will call on TSMC to use its N3 (3nm) combustion terminal, which is more than twice the number of units that can be executed for graphics architecture alone. Funnily enough, Intel does not use its own engraving factories – an outsourcing, however, was planned for a few months.
The second tile, the processor cores themselves. This part is carried out internally in the Intel 4 process, which, as its name implies, is the Intel engraving process at 7 nm. Finally, the last tile related to the management (I / O) support of RAM or PCI-e is carried out at TSMC, but at 5 nm, even 4 nm (actually upgraded to 5 nm))
The use of tiles using various engraving processes is reminiscent of AMD’s approach. In fact, Intel’s competitor introduced this system in its Raison processors a few years ago. The hearts of the Ryzen 5000 are engraved at 7 nm for example, while the volume dedicated to management is at 12 nm. This prudent choice makes it possible to reduce the cost of production and avoid being overly limited by production payments at TSMC. By using different engraving processes and outsourcing a portion of them, Intel can avoid being hampered in its productivity, a problem it has been facing with its 10 nm chips in recent years.
Meteor Lake processors are expected in the second quarter of 2023. They will introduce new high performance (Redwood Cove) and more efficient (Crestmont) cores, and there is no indication that they will still use the latest LGA1700 socket. Processors. Alter Lake – 12th Generation Course.
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